Intel Corporation announced plans to establish a $3.3 billion semiconductor substrate manufacturing facility in India's Odisha state, partnering with 3DGS on the project. The facility represents a significant investment in India's growing semiconductor manufacturing sector.

The substrate plant will contribute to Intel's broader strategy of expanding manufacturing capabilities beyond traditional strongholds. Semiconductor substrates are critical components that serve as the foundation for mounting and connecting semiconductor chips in electronic devices.

Separately, Taiwan-based MediaTek, one of the world's largest semiconductor companies, announced it will support advanced packaging technologies from both Taiwan Semiconductor Manufacturing Company (TSMC) and Intel. This decision reflects MediaTek's strategy to work with multiple technology providers rather than relying on a single supplier.

Advanced packaging technologies are becoming increasingly important in the semiconductor industry as companies seek to improve chip performance while managing costs. These technologies allow for more sophisticated integration of multiple components into single packages.

The announcements come amid global efforts to diversify semiconductor supply chains and reduce dependence on concentrated manufacturing regions. Both developments signal continued investment and competition in advanced semiconductor technologies across Asia.